Overview

The D9650Z incorporates the latest C-SAM technology with enhanced features to accommodate the testing of Power Modules as well as performing standard C-SAM operations. This new system configuration is optimized for inspection of heatsink bond integrity, thickness of bond layer and wire bond welds. Powered by our Sonolytics software platform with PolyGate technology, the D9650Z is ideal for failure analysis, process development and QC screening in low-volume production environments.

Features

• WaterPlume for scanning from underneath the sample keeping the sample dry.

• Integrated dryer to remove excess water from samples prior to removal.

• Optional Digital Image Analysis (DIA) sets automatic accept/reject criteria.

• Sonolytics2 interface in Windows® 10 Ultimate for multi-language and 64 bit capabilities.

• Precise scanning with tower mounted scan reference platform and sample fixture.

Enhanced features to accommodate the testing of:

• Power Modules as well as performing standard C-SAM operations

Optimal for inspection of: 

• Heatsink bond integrity

• Thickness of bond layer and wire bond welds

• Ideal for Failure Analysis, process development and QC screening